IC-Shipping Tray Product Overview
The Tray is Semiconductor packing media which is made of high functional raw materials to protect IC components from external damage or static electricity and fits for automatic machines for semiconductor manufacturing and SMT processes. It has characteristics of high precision, strong anti-temperature and conductivity.
Classification
- - JEDEC Tray
- - EIAJ Tray
- - Customizing Tray
Major Characteristics of products
- Various Semiconductor Application : TSOP, QFP, QFN, LGA, SIP, BGA, BOC, MCP, eMMC, CSP, FCBGA
- JEDEC & EIAJ Tray / Customized Tray
- Highly optimized materials use for Customer Specification & Needs.
* MPPO (130℃ / 150℃) / MPSU (130℃ / 150℃) / PES (180℃) / PEEK (230℃ / 260℃)
- Realization of Characteristics of Static Electricity : Carbon Fiber / Carbon Powder / Carbon Nano Tube
- Low Particle Tray development (Low Particle Tray development(Air cleaning line set up for LP tray)
- Anti-Oxidation Tray development (PKG Discolor protection)
- R&D for IC-Tray design and development : Continuous Research and Development(Enrollment of 2 patents)
- In House Tool Shop Setup for high quality and on time delivery.
STM Standard Materials
| Material | Bake Temp | Data Sheet |
|---|---|---|
| MPPO / Carbon fiber | 130℃ MAX |  |
| 150℃ MAX | |
|
| Low Particle MPPO / Carbon Fiber |
150℃ MAX | |
| MPSU / Carbon Fiber | 140℃ MAX | |
| 150℃ MAX | |
|
| PES / Carbon Fiber | 180℃ MAX | |
| PPE / Carbon Powder | 130℃ MAX | |
| CNT / Carbon Nano Tube | 130℃ MAX | |